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SAN JOSE, Calif.--(BUSINESS WIRE)--July 25, 2001--inSilicon Corporation (Nasdaq:INSN) -- a leading provider of communications technology for complex systems-on-chip (SOC) -- today announced that its USB 2.0 Universal Transceiver Macrocell Interface (UTMI) Physical Layer (USB 2 PHY) is the world's first semiconductor intellectual property (IP) to pass full USB 2.0 compliance testing, a key achievement in ensuring functionality, and interoperability in next-generation USB 2.0 PC and consumer products. The USB 2.0 standard accelerates performance by 40 times over USB 1.1 in demanding new applications, including desktop video cameras, portable storage, CD-R/W, optical scanners, inkjet and laser printers, TV tuners, and audio speakers.

Certification at Intel Lab

``Obtaining the USB-IF High Speed certification for our USB 2.0 UTMI PHY is a significant milestone,'' said Xerxes Wania, vice president of mixed-signal products at inSilicon. ``USB-IF certification helps assure customers that the USB 2 PHY meets the integration and interoperability standards established by the industry. The inSilicon USB 2 PHY architecture is designed for SOC implementation in a demanding noisy on-chip environment, where it will be combined with other large digital and analog functions. The architecture also features advanced power management to provide low power dissipation in portable and embedded applications. Combining the USB 2 PHY with our industry-leading USB 2.0 Device or Host Controller enables customers to realize significant reductions in system cost, size, power, time-to-market and risk for their SOC implementations.''

``USB Implementer's Forum certification of USB 2.0 products helps the designer meet consumer expectations for quality and ease of use,'' said Jason Ziller, Intel technology initiatives manager and USB-IF chairman. ``Availability of certified Hi-Speed USB 2.0 IP from industry leaders such as inSilicon will help drive the growth of USB 2.0 with new products that meet consumer demand for bandwidth and usability.''

Tality Partnership

``Tality's partnership with inSilicon for the joint development of the USB 2 PHY ensured our first-pass success in silicon,'' stated Ron Gyurcsik, head of Tality's Datacom IC Strategic Business Group. ``The combination of Tality's extensive experience in mixed-signal and high-speed PHY design with the USB domain expertise of inSilicon, resulted in a robust design that is demonstrated to be electrically and functionally correct the first time.''

USB 2 PHY

inSilicon's USB 2 PHY is a complete mixed-signal semiconductor IP solution designed for single-chip USB 2.0 integration in both device and host applications. The USB 2 PHY integrates high-speed, mixed-signal, custom CMOS circuitry compliant with the industry-standard UTMI Specification (version 1.05). USB 2 PHY technology supports the USB 2.0 480-Mbps protocol and data rate, and is backward compatible with the USB 1.1 legacy protocol at 1.5 and 12 Mbps.

The TSMC 0.18-micron generic, digital logic CMOS process is the initial foundry process for the USB 2 PHY. A USB 2 PHY design for the UMC 0.18-micron generic logic process is currently under development.

Deliverables and Availability

inSilicon's USB 2 PHY deliverables include all of the required logical and physical design files, documentation, training and support to enable designers to fully implement USB 2.0 functionality in their SOC design. Semiconductor designers with mixed-signal capability can also license inSilicon's USB 2 PHY Integration Kit to create USB 2.0 UTMI physical layer components in other proprietary processes. The deliverables for the USB 2 PHY Integration Kit include additional training and transfer of design knowledge to successfully port this design to the targeted process. inSilicon and Tality can also offer design consulting and implementation services for customers building USB 2 silicon.

The USB 2 PHY is available for licensing and integration today. Contact inSilicon for pricing information at 408/894-1900 or by e-mail at in-demand@insilicon.com.

About inSilicon

inSilicon Corporation is a leading provider of communications semiconductor intellectual property used by semiconductor and systems companies to design systems-on-chip that are critical components of innovative wired and wireless products. inSilicon's technology provides customers faster time-to-market and reduced risk and development cost. The company's broad portfolio of analog and mixed-signal products and enabling communications technologies, including the JVX(TM) Accelerators, Bluetooth, Ethernet, USB, PCI, and IEEE-1394, are used in a wide variety of markets encompassing communications, consumer, computing, and office automation. Information about inSilicon products and technologies is available at http://www.insilicon.com.

About Tality

Tality Corporation, formerly the Electronic Design Services group of Cadence Design Systems, Inc. (NYSE:CDN), was launched as a separate company in October 2000. With more than 1,100 engineers located in 14 design sites worldwide, Tality is the world's largest independent provider of engineering services and intellectual property for the design of complex electronic systems and integrated circuits. Tality is headquartered at 555 River Oaks Parkway, Building No. 3, San Jose, Calif., 95134. www.tality.com

Note to Editors: inSilicon and JVX(TM) are trademarks of inSilicon Corporation.

     inSilicon Corporation
     Gervais Fong, 408/570-1650
     gervais_fong@insilicon.com
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     Doug Sherk or Ty George, 415/296-7383 (IR)
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